This paper introduces a novel design for a multiple node upset tolerant flip-flop. This design uses the TDICE memory cell that was proposed in the technical literature for memory arrays and applies its principles of operation to a Master Slave flip-flop implemented at 65 nm CMOS technology. It is shown that the proposed design approach is particularly suited for flip-flops targeting highly radioactive environments; simulation validates the multiple node upset tolerance and its viability. A test chip developed for the on-silicon validation is also described.

Campitelli, S., Ottavi, M., Pontarelli, S., Marchioro, A., Felici, D., Lombardi, F. (2013). F-DICE: a multiple node upset tolerant flip-flop for highly radioactive environments. In 2013 IEEE International Symposium on defect and fault tolerance in VLSI and nanotechnology systems (DFT) (pp.107-111). IEEE [10.1109/DFT.2013.6653591].

F-DICE: a multiple node upset tolerant flip-flop for highly radioactive environments

OTTAVI, MARCO;PONTARELLI, SALVATORE;
2013-10-01

Abstract

This paper introduces a novel design for a multiple node upset tolerant flip-flop. This design uses the TDICE memory cell that was proposed in the technical literature for memory arrays and applies its principles of operation to a Master Slave flip-flop implemented at 65 nm CMOS technology. It is shown that the proposed design approach is particularly suited for flip-flops targeting highly radioactive environments; simulation validates the multiple node upset tolerance and its viability. A test chip developed for the on-silicon validation is also described.
IEEE International Symposium on defect and fault tolerance in VLSI and nanotechnology systems (DFT)
2013
Rilevanza internazionale
ott-2013
Settore ING-INF/01 - ELETTRONICA
English
Intervento a convegno
Campitelli, S., Ottavi, M., Pontarelli, S., Marchioro, A., Felici, D., Lombardi, F. (2013). F-DICE: a multiple node upset tolerant flip-flop for highly radioactive environments. In 2013 IEEE International Symposium on defect and fault tolerance in VLSI and nanotechnology systems (DFT) (pp.107-111). IEEE [10.1109/DFT.2013.6653591].
Campitelli, S; Ottavi, M; Pontarelli, S; Marchioro, A; Felici, D; Lombardi, F
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2108/90255
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