In this contribution, a high power density and efficiency C-Band hybrid power amplifier (PA), employing the GaN process developed at Selex ES, is presented. Thanks to technological improvements in the actual process, the current collapse and knee voltage shift problems are mitigated, showing 5W/mm power density at 20 V, with a linear output power increase as function of drain bias, up to 9.5W/mm at 35V. In order to assess the actual performances of the GaN HEMTs, the most representative active device has been characterized and modeled, and a PA at 5.5 GHz has been designed. The amplifier is designed utilizing second harmonic tuning strategy for high efficiency operation, thus exploiting the high-breakdown voltage peculiarity of GaN-based devices employing Field Plate technology. The PA shows an output power of 36.5 dBm with a power added efficiency (PAE) of 65 % and an associated gain of 12 dB while the preliminary evaluation estimate a MTTF of 107h.

Giofre', R., Colantonio, P., Giannini, F., Pantellini, A., Nanni, A., Dispenza, M., et al. (2013). A GaN on SiC process with high power density and efficiency. In 2013 European Microwave Integrated Circuits Conference (EuMIC) (pp.180-183).

A GaN on SiC process with high power density and efficiency

GIOFRE', ROCCO;COLANTONIO, PAOLO;GIANNINI, FRANCO;
2013-01-01

Abstract

In this contribution, a high power density and efficiency C-Band hybrid power amplifier (PA), employing the GaN process developed at Selex ES, is presented. Thanks to technological improvements in the actual process, the current collapse and knee voltage shift problems are mitigated, showing 5W/mm power density at 20 V, with a linear output power increase as function of drain bias, up to 9.5W/mm at 35V. In order to assess the actual performances of the GaN HEMTs, the most representative active device has been characterized and modeled, and a PA at 5.5 GHz has been designed. The amplifier is designed utilizing second harmonic tuning strategy for high efficiency operation, thus exploiting the high-breakdown voltage peculiarity of GaN-based devices employing Field Plate technology. The PA shows an output power of 36.5 dBm with a power added efficiency (PAE) of 65 % and an associated gain of 12 dB while the preliminary evaluation estimate a MTTF of 107h.
Microwave Integrated Circuits Conference (EuMIC), 2013 European
Nuremberg
2013
8
Rilevanza internazionale
contributo
ott-2013
2013
Settore ING-INF/01 - ELETTRONICA
English
high electron mobility transistors;power amplifiers;GaN;MTTF;PAE;frequency 5.5 GHz;harmonic tuning strategy;high breakdown voltage peculiarity;power added efficiency;representative active device;voltage 20 V;voltage 35 V;Density measurement;Gallium nitride;Harmonic analysis;Performance evaluation;Power amplifiers;Power generation;Power system measurements;2nd HT PA;Device Process;GaN;Modelling
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6687815&queryText%3DA+GaN+on+SiC+process+with+high+power+density+and+efficiency
Intervento a convegno
Giofre', R., Colantonio, P., Giannini, F., Pantellini, A., Nanni, A., Dispenza, M., et al. (2013). A GaN on SiC process with high power density and efficiency. In 2013 European Microwave Integrated Circuits Conference (EuMIC) (pp.180-183).
Giofre', R; Colantonio, P; Giannini, F; Pantellini, A; Nanni, A; Dispenza, M; Lanzieri, C
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2108/83507
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