The electrodeposition process holds significant industrial interest, allowing for coatings on electrically conductive materials to impart diverse properties to substrates. Primarily utilized to enhance the corrosion resistance of the base material, it is also intriguing both in industrial and academic contexts for conferring additional characteristics. This study examines the application of copper electrodeposition onto an aluminum wire to increase electrical and thermal conductivity, achieving a coating of a few microns. The varied factors include both process parameters, such as current density and electrolyte composition, and shape parameters related to the geometries of the electrode and the component to be coated.

Almonti, D., Baiocco, G., Della Millia, M., Mingione, E., Rubino, G., Salvi, D., et al. (2026). Simulation and functional characterization of Cu coating on aluminum components for improvement of thermal and electrical properties. In 18th CIRP Conference on Intelligent Computation in Manufacturing Engineering (pp.1115-1120). Amsterdam : Elsevier [10.1016/j.procir.2026.01.192].

Simulation and functional characterization of Cu coating on aluminum components for improvement of thermal and electrical properties

Daniele Almonti
;
Gabriele Baiocco;Massimiliano Della Millia;Emanuele Mingione;Daniel Salvi;Nadia Ucciardello
2026-01-01

Abstract

The electrodeposition process holds significant industrial interest, allowing for coatings on electrically conductive materials to impart diverse properties to substrates. Primarily utilized to enhance the corrosion resistance of the base material, it is also intriguing both in industrial and academic contexts for conferring additional characteristics. This study examines the application of copper electrodeposition onto an aluminum wire to increase electrical and thermal conductivity, achieving a coating of a few microns. The varied factors include both process parameters, such as current density and electrolyte composition, and shape parameters related to the geometries of the electrode and the component to be coated.
18th CIRP Conference on Intelligent Computation in Manufacturing Engineering
Ischia
2024
18
Rilevanza internazionale
contributo
lug-2024
gen-2026
Settore IIND-04/A - Tecnologie e sistemi di lavorazione
English
Copper Electroplating
FEA
Intervento a convegno
Almonti, D., Baiocco, G., Della Millia, M., Mingione, E., Rubino, G., Salvi, D., et al. (2026). Simulation and functional characterization of Cu coating on aluminum components for improvement of thermal and electrical properties. In 18th CIRP Conference on Intelligent Computation in Manufacturing Engineering (pp.1115-1120). Amsterdam : Elsevier [10.1016/j.procir.2026.01.192].
Almonti, D; Baiocco, G; Della Millia, M; Mingione, E; Rubino, G; Salvi, D; Ucciardello, N
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2108/451704
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