Electroplating is a widely used technique for depositing metallic layers on conductive surfaces, with applications in corrosion protection, electronics, and RF devices. When applied to dielectric substrates, a conductive mask is required to define the plating regions. Laser-Induced Graphene (LIG) offers a promising alternative to conventional metallic inks by enabling direct patterning of conductive traces. However, achieving uniform metal deposition on LIG remains a challenge, particularly for large-scale structures such as antennas. This study experimentally investigates the influence of LIG conductivity on electroplating uniformity. Dipole antennas with different LIG sheet resistances were fabricated and subjected to identical electroplating conditions. Results show that lower LIG conductivity significantly improves deposition homogeneity, enhancing the realized gain of the antennas by over 8 dBi. These findings provide key insights for optimizing LIG-based electroplating processes in RF and flexible electronics applications.
Mostaccio, A., Marrocco, G. (2025). Electroplating of flexible antennas by Laser-Induced Graphene priming. In 2025 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS): proceedings (pp.1-3). New York : IEEE [10.1109/fleps65444.2025.11105672].
Electroplating of flexible antennas by Laser-Induced Graphene priming
Mostaccio, Alessio
;Marrocco, Gaetano
2025-01-01
Abstract
Electroplating is a widely used technique for depositing metallic layers on conductive surfaces, with applications in corrosion protection, electronics, and RF devices. When applied to dielectric substrates, a conductive mask is required to define the plating regions. Laser-Induced Graphene (LIG) offers a promising alternative to conventional metallic inks by enabling direct patterning of conductive traces. However, achieving uniform metal deposition on LIG remains a challenge, particularly for large-scale structures such as antennas. This study experimentally investigates the influence of LIG conductivity on electroplating uniformity. Dipole antennas with different LIG sheet resistances were fabricated and subjected to identical electroplating conditions. Results show that lower LIG conductivity significantly improves deposition homogeneity, enhancing the realized gain of the antennas by over 8 dBi. These findings provide key insights for optimizing LIG-based electroplating processes in RF and flexible electronics applications.| File | Dimensione | Formato | |
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