Alibakhshikenari, M., Virdee, B.s., See, C.h., Fishlock, S.j., Soin, N., Mclaughlin, J., et al. (2019). Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. ??????? it.cilea.surplus.oa.citation.tipologie.CitationProceedings.prensentedAt ??????? 8th Asia-Pacific Conference on Antennas and Propagation (APCAP 2019), Seoul, South Korea [10.1109/APCAP47827.2019.9472184].

Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Limiti E.
2019-08-01

8th Asia-Pacific Conference on Antennas and Propagation (APCAP 2019)
Seoul, South Korea
2019
8
Rilevanza internazionale
contributo
ago-2019
Settore ING-INF/01 - ELETTRONICA
English
Intervento a convegno
Alibakhshikenari, M., Virdee, B.s., See, C.h., Fishlock, S.j., Soin, N., Mclaughlin, J., et al. (2019). Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. ??????? it.cilea.surplus.oa.citation.tipologie.CitationProceedings.prensentedAt ??????? 8th Asia-Pacific Conference on Antennas and Propagation (APCAP 2019), Seoul, South Korea [10.1109/APCAP47827.2019.9472184].
Alibakhshikenari, M; Virdee, Bs; See, Ch; Fishlock, Sj; Soin, N; Mclaughlin, J; Abd-Alhameed, Ra; Limiti, E
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2108/298167
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