Alibakhshikenari, M., Virdee, B.s., See, C.h., Fishlock, S.j., Soin, N., Mclaughlin, J., et al. (2019). Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. ??????? it.cilea.surplus.oa.citation.tipologie.CitationProceedings.prensentedAt ??????? 8th Asia-Pacific Conference on Antennas and Propagation (APCAP 2019), Seoul, South Korea [10.1109/APCAP47827.2019.9472184].
Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components
Limiti E.
2019-08-01
File in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
