Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have been also discussed.
Lucibello, A., Capoccia, G., Proietti, E., Marcelli, R., Margesin, B., Mulloni, V., et al. (2014). Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp.1-5). IEEE [10.1109/DTIP.2014.7056679].
Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
BARTOLUCCI, GIANCARLO
2014-01-01
Abstract
Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have been also discussed.| File | Dimensione | Formato | |
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