Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have been also discussed.

Lucibello, A., Capoccia, G., Proietti, E., Marcelli, R., Margesin, B., Mulloni, V., et al. (2014). Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp.1-5). IEEE [10.1109/DTIP.2014.7056679].

Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress

BARTOLUCCI, GIANCARLO
2014

Abstract

Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have been also discussed.
DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Cannes
2014
Rilevanza internazionale
contributo
apr-2014
Settore ING-INF/01 - Elettronica
English
redundancy; reliability; RF MEMS; space components
Intervento a convegno
Lucibello, A., Capoccia, G., Proietti, E., Marcelli, R., Margesin, B., Mulloni, V., et al. (2014). Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp.1-5). IEEE [10.1109/DTIP.2014.7056679].
Lucibello, A; Capoccia, G; Proietti, E; Marcelli, R; Margesin, B; Mulloni, V; Giacomozzi, F; Vitulli, F; Scipioni, M; Bartolucci, G
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/2108/183149
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