Purpose: The aim of this study was to investigate whether an electrical device for dental adhesive application (ElectroBond) influences bonding of two-step etch-and-rinse adhesives. Materials and Methods: Human teeth were selected and cut perpendicularly to their long axis to expose middle/deep dentin. Specimens were then longitudinally sectioned into halves (experimental and control halves) to create two similar bonding substrates. Experimental halves were bonded using an ElectroBond-assisted application, while control halves were bonded with disposable sponges. The adhesives tested were Adper Scotchbond 1XT and XP-BOND. Bonded specimens were submitted to the microtensile bond strength test. Additional adhesive interfaces were prepared and processed for nanoleakage investigation involving TEM examination. Results: The microtensile bond test revealed higher values (p < 0.05) for both adhesives if ElectroBond was used during layering (55.5 +/- 7.9 IVIPa for Adper Scotchbond 1XT and 54.7 +/- 7.1 IVIPa for XP-BOND) compared to the conventional mechanical adhesive application technique (41.1 +/- 6.1 MPa for Adper Scotchbond 1XT and 38.0 +/- 7.8 MPa for XP-BOND). No difference between the two adhesives was found under the same application conditions. With electricity-assisted application, TEM micrographs revealed a significant decrease in nanoleakage expression compared to the controls. Conclusion: The use of an electric current produced by ElectroBond during the application of two-step etch-and-rinse adhesives may enhance resin impregnation, thus improving dentin hybridization. Further studies should be done to confirm that this device can similarly improve adhesive application in vivo.
|Tipologia:||Articolo su rivista|
|Citazione:||Mazzoni, A., Visintini, E., Vita, F., Pasquantonio, G., Saboia, V., Ruggeri, A., et al. (2009). ElectroBond Improves Immediate Dentin Microtensile Bond Strength of Two Etch-and-Rinse Adhesives. JOURNAL OF ADHESIVE DENTISTRY, 11(1), 27-33.|
|Altre informazioni significative:||7|
|IF:||Con Impact Factor ISI|
|Settore Scientifico Disciplinare:||Settore MED/28 - Malattie Odontostomatologiche|
|Revisione (peer review):||Esperti anonimi|
|Stato di pubblicazione:||Pubblicato|
|Data di pubblicazione:||2009|
|Titolo:||ElectroBond Improves Immediate Dentin Microtensile Bond Strength of Two Etch-and-Rinse Adhesives|
|Autori interni:||PASQUANTONIO, GUIDO|
|Autori:||Mazzoni, A; Visintini, E; Vita, F; Pasquantonio, G; Saboia, VPA; Ruggeri, A; Di Lenarda, R; Dorigo, E; Breschi, L|
|Appare nelle tipologie:||01 - Articolo su rivista|
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