A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-1.3 J/m(2) range and was depending on the morphology of the interface. (C) 2002 Elsevier Science B.V. All rights reserved.
Kamiya, S., Takahashi, H., D'Antonio, P., Polini, R., & Traversa, E. (2002). Quantitative comparison of adhesive toughness for various diamond films on Co-cemented tungsten carbide. DIAMOND AND RELATED MATERIALS, 11, 716-720.
Tipologia: | Articolo su rivista |
Citazione: | Kamiya, S., Takahashi, H., D'Antonio, P., Polini, R., & Traversa, E. (2002). Quantitative comparison of adhesive toughness for various diamond films on Co-cemented tungsten carbide. DIAMOND AND RELATED MATERIALS, 11, 716-720. |
IF: | Con Impact Factor ISI |
Lingua: | English |
Settore Scientifico Disciplinare: | Settore CHIM/03 - Chimica Generale e Inorganica Settore ING-IND/22 - Scienza e Tecnologia dei Materiali |
Revisione (peer review): | Sì, ma tipo non specificato |
Tipo: | Articolo |
Rilevanza: | Rilevanza internazionale |
Digital Object Identifier (DOI): | http://dx.doi.org/10.1016/S0925-9635(01)00709-9 |
Stato di pubblicazione: | Pubblicato |
Data di pubblicazione: | 2002 |
Titolo: | Quantitative comparison of adhesive toughness for various diamond films on Co-cemented tungsten carbide |
Autori: | |
Autori: | Kamiya, S; Takahashi, H; D'Antonio, P; Polini, R; Traversa, E |
Appare nelle tipologie: | 01 - Articolo su rivista |