A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-1.3 J/m(2) range and was depending on the morphology of the interface. (C) 2002 Elsevier Science B.V. All rights reserved.
Kamiya, S., Takahashi, H., D'Antonio, P., Polini, R., Traversa, E. (2002). Quantitative comparison of adhesive toughness for various diamond films on Co-cemented tungsten carbide. DIAMOND AND RELATED MATERIALS, 11, 716-720 [10.1016/S0925-9635(01)00709-9].
Quantitative comparison of adhesive toughness for various diamond films on Co-cemented tungsten carbide
POLINI, RICCARDO;TRAVERSA, ENRICO
2002-01-01
Abstract
A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-1.3 J/m(2) range and was depending on the morphology of the interface. (C) 2002 Elsevier Science B.V. All rights reserved.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
