Advanced interconnect technologies are enabling solutions to obtain adequate low-noise amplifier performance even when the circuit is packaged and connected inside a receiver module. In this letter, we present suitable technology and design solutions of a gallium arsenide low-noise amplifier operating in the telecom W-band (92–115 GHz) featuring 20-dB gain and 4.1-dB noise figure accounting for through-the-substrate RF interconnect (hot vias) effects. To the best of the author’s knowledge, this is the first low-noise amplifier with hot via interconnections operating up to 115 GHz showing characterized data in terms of noise figure and third-order intermodulation.
Longhi, P.e., Colangeli, S., Ciccognani, W., Parand, P., Serino, A., Limiti, E. (2025). 4.1-dB noise figure and 20-dB gain 92–115-GHz GaAs LNA with hot via interconnections. IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS, 35(3), 334-337 [10.1109/LMWT.2024.3520229].
4.1-dB noise figure and 20-dB gain 92–115-GHz GaAs LNA with hot via interconnections
Longhi P. E.;Colangeli S.;Ciccognani W.;Parand P.;Serino A.;Limiti E.
2025-01-01
Abstract
Advanced interconnect technologies are enabling solutions to obtain adequate low-noise amplifier performance even when the circuit is packaged and connected inside a receiver module. In this letter, we present suitable technology and design solutions of a gallium arsenide low-noise amplifier operating in the telecom W-band (92–115 GHz) featuring 20-dB gain and 4.1-dB noise figure accounting for through-the-substrate RF interconnect (hot vias) effects. To the best of the author’s knowledge, this is the first low-noise amplifier with hot via interconnections operating up to 115 GHz showing characterized data in terms of noise figure and third-order intermodulation.| File | Dimensione | Formato | |
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4.1-dB_Noise_Figure_and_20-dB_Gain_92115-GHz_GaAs_LNA_With_Hot_Via_Interconnections.pdf
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