In this paper, two tin-based alloys (Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn) are proposed as new lead-free solders. Alloys have been developed by melting pure elements. Samples have been evaluated in terms of microstructure, corrosion resistance and mechanical features. Corrosion tests have been performed in 3% NaCl solution by polarization curves and electrochemical impedance spectroscopy (EIS). SEM observations and EDS analysis were carried out on samples before and after corrosion tests. Static monotonic tensile tests have been performed on three specimens for each alloy. SEM and EDS analysis revealed the presence of Sn-Ag and Sn-Cu intermetallic compounds within the Sn-Ag-Cu alloy. As a result of corrosion test, the Sn-Ag-Cu alloy showed a better corrosion resistance with respect to Sn-Bi-Zn. Both alloys evidenced good mechanical properties higher than the traditional Sn-Pb system. Sn-Ag-Cu seems to be a suitable soldering material.

Montesperelli, G., Rapone, M., Nanni, F., Travaglla, P., Riani, P., Marazza, R., et al. (2008). Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders, 59(8), 662-669 [10.1002/maco.200804098].

Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders

MONTESPERELLI, GIAMPIERO;NANNI, FRANCESCA;GUSMANO, GUALTIERO
2008-01-01

Abstract

In this paper, two tin-based alloys (Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn) are proposed as new lead-free solders. Alloys have been developed by melting pure elements. Samples have been evaluated in terms of microstructure, corrosion resistance and mechanical features. Corrosion tests have been performed in 3% NaCl solution by polarization curves and electrochemical impedance spectroscopy (EIS). SEM observations and EDS analysis were carried out on samples before and after corrosion tests. Static monotonic tensile tests have been performed on three specimens for each alloy. SEM and EDS analysis revealed the presence of Sn-Ag and Sn-Cu intermetallic compounds within the Sn-Ag-Cu alloy. As a result of corrosion test, the Sn-Ag-Cu alloy showed a better corrosion resistance with respect to Sn-Bi-Zn. Both alloys evidenced good mechanical properties higher than the traditional Sn-Pb system. Sn-Ag-Cu seems to be a suitable soldering material.
2008
Pubblicato
Rilevanza internazionale
Articolo
Sì, ma tipo non specificato
Settore ING-IND/22 - SCIENZA E TECNOLOGIA DEI MATERIALI
English
Alloys; Arsenic compounds; Atmospheric corrosion; Bismuth plating; Brazing; Chlorine compounds; Copper; Copper alloys; Corrosion; Corrosion resistance; Electrochemical corrosion; Electrochemical impedance spectroscopy; Explosive actuated devices; Intermetallics; Lead; Mechanical properties; Metallic compounds; Metals; Painting; Secondary emission; Silver; Silver alloys; Sodium chloride; Soldering alloys; Superconducting tapes; Tensile testing; Testing; Tin alloys; Titanium compounds; Welding; Welds; Zinc; Before and after; Corrosion testing; EDS analysis; Intermetallic compounds; Lead-free soldering; Mechanical behaviours; Mechanical features; NaCl solutions; Polarization curves; Pure elements; Sn-Ag-Cu; Sn-Ag-Cu alloys; Tensile tests; Tin
Montesperelli, G., Rapone, M., Nanni, F., Travaglla, P., Riani, P., Marazza, R., et al. (2008). Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders, 59(8), 662-669 [10.1002/maco.200804098].
Montesperelli, G; Rapone, M; Nanni, F; Travaglla, P; Riani, P; Marazza, R; Gusmano, G
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2108/28588
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