Space components need a ground characteriza- tion based on several solicitations, including mechanical and thermal stress, before their final qualification . I n this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contri- butions have also been discussed.
Lucibello, A., Capoccia, G., Proietti, E., Marcelli, R., Margesin, B., Mulloni, V., et al. (2016). Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress. MICROSYSTEM TECHNOLOGIES, 22(3), 495-501 [10.1007/s00542-015-2577-5].
Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
BARTOLUCCI, GIANCARLO
2016-03-01
Abstract
Space components need a ground characteriza- tion based on several solicitations, including mechanical and thermal stress, before their final qualification . I n this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contri- butions have also been discussed.| File | Dimensione | Formato | |
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