Objectives. This study investigated the effects of an electric field produced by a new device for the application of etch-and-rinse adhesives on demineralized dentin surfaces. Methods. Three simplified etch-and-rinse adhesives (Single Bond, Prime&Bond NT and One-Step) were applied with the electric device and compared with controls prepared with disposable sponges. Specimens were processed for microtensile bond strength test and nanoleakage investigation using high resolution SEM. Results. Microtensile testing revealed higher bond strengths (p < 0.05) for all adhesives tested when electricity was used. Adhesive interfaces prepared with electric impulses exhibited very homogenous hybrid layers with minimal nanoleakage compared with the controls. Significance. The use of electricity produced by a new electronic device during the application of dentin adhesives may increase adhesive adaptation to the dentin substrate and improve dentin hybridization due to the substrate modifications induced by an electric field on the demineralized dentin organic matrix

Pasquantonio, G., Tay, F., Mazzoni, A., Suppa, P., Ruggeri, A.j., Falconi, M., et al. (2007). Electric device improves bonds of simplified etch-and-rinse adhesives. DENTAL MATERIALS, 23(4), 513-518 [10.1016/j.dental.2006.03.009].

Electric device improves bonds of simplified etch-and-rinse adhesives

PASQUANTONIO, GUIDO;
2007-01-01

Abstract

Objectives. This study investigated the effects of an electric field produced by a new device for the application of etch-and-rinse adhesives on demineralized dentin surfaces. Methods. Three simplified etch-and-rinse adhesives (Single Bond, Prime&Bond NT and One-Step) were applied with the electric device and compared with controls prepared with disposable sponges. Specimens were processed for microtensile bond strength test and nanoleakage investigation using high resolution SEM. Results. Microtensile testing revealed higher bond strengths (p < 0.05) for all adhesives tested when electricity was used. Adhesive interfaces prepared with electric impulses exhibited very homogenous hybrid layers with minimal nanoleakage compared with the controls. Significance. The use of electricity produced by a new electronic device during the application of dentin adhesives may increase adhesive adaptation to the dentin substrate and improve dentin hybridization due to the substrate modifications induced by an electric field on the demineralized dentin organic matrix
2007
Pubblicato
Rilevanza internazionale
Articolo
Esperti anonimi
Settore MED/28 - MALATTIE ODONTOSTOMATOLOGICHE
English
Con Impact Factor ISI
adhesives; bond strength (materials); electric field effects; electronic equipment; etching; scanning electron microscopy; dentin; dentin adhesives; dentin bonding systems; FEISEM; microtensile bond strength; substrate modifications; dental materials; bisphenol a bis(2 hydroxypropyl) ether dimethacrylate; dentin bonding agent; methacrylic acid derivative; one step dentin bonding system; one-step dentin bonding system; polymethacrylic acid derivative; prime & bond NT; resin cement; single bond; article; dental bonding; dental care; dental equipment; dentin; electricity; human; molar tooth; scanning electron microscopy; single blind procedure; tensile strength; tooth disease; tooth permeability; bisphenol a-glycidyl methacrylate; dental bonding; dental equipment; dental leakage; dental stress analysis; dentin; dentin permeability; dentin-bonding agents; electricity; humans; methacrylates; microscopy, electron, scanning; molar, third; polymethacrylic acids; resin cements; single-blind method; tensile strength; tooth demineralization
Pasquantonio, G., Tay, F., Mazzoni, A., Suppa, P., Ruggeri, A.j., Falconi, M., et al. (2007). Electric device improves bonds of simplified etch-and-rinse adhesives. DENTAL MATERIALS, 23(4), 513-518 [10.1016/j.dental.2006.03.009].
Pasquantonio, G; Tay, F; Mazzoni, A; Suppa, P; Ruggeri, Aj; Falconi, M; Di Lenarda, R; Breschi, L
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/2108/59039
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